JPH08375Y2 - メッキ装置の陽極構造 - Google Patents
メッキ装置の陽極構造Info
- Publication number
- JPH08375Y2 JPH08375Y2 JP8603190U JP8603190U JPH08375Y2 JP H08375 Y2 JPH08375 Y2 JP H08375Y2 JP 8603190 U JP8603190 U JP 8603190U JP 8603190 U JP8603190 U JP 8603190U JP H08375 Y2 JPH08375 Y2 JP H08375Y2
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- plating
- electrode
- plated
- anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 title description 47
- 238000005192 partition Methods 0.000 claims 1
- 239000000654 additive Substances 0.000 description 10
- 230000000996 additive effect Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000000354 decomposition reaction Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000002198 insoluble material Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910000457 iridium oxide Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 150000002898 organic sulfur compounds Chemical class 0.000 description 1
- 238000006864 oxidative decomposition reaction Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8603190U JPH08375Y2 (ja) | 1990-08-15 | 1990-08-15 | メッキ装置の陽極構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8603190U JPH08375Y2 (ja) | 1990-08-15 | 1990-08-15 | メッキ装置の陽極構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0444374U JPH0444374U (en]) | 1992-04-15 |
| JPH08375Y2 true JPH08375Y2 (ja) | 1996-01-10 |
Family
ID=31817476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8603190U Expired - Lifetime JPH08375Y2 (ja) | 1990-08-15 | 1990-08-15 | メッキ装置の陽極構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08375Y2 (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19834353C2 (de) * | 1998-07-30 | 2000-08-17 | Hillebrand Walter Gmbh & Co Kg | Alkalisches Zink-Nickelbad |
| KR101451483B1 (ko) * | 2012-12-28 | 2014-10-15 | 삼성전기주식회사 | 전해도금 장치 |
-
1990
- 1990-08-15 JP JP8603190U patent/JPH08375Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0444374U (en]) | 1992-04-15 |
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